Thank you, operator, and thanks, everyone, for joining us on the call today. Everspin delivered quarterly revenue of $15.7 million, above the high end of guidance, a 7% increase year-over-year. We were GAAP net income positive for the ninth quarter in a row which continues to be a strong focus for the company. A few highlights for Q2 2023. Cash flow from operations was $6.3 million, putting us at $7.5 million year-to-date. We continue to operate debt-free while increasing profitability. In Q2, we started sampling our new xSPI family of STT-MRAM products from 4 megabit to 16 megabit in BGA and DFN packages with production planned in Q3 of 2023. As a reminder, we taped out this family of products in Q4 of 2022. In response to our customer requests, we have introduced a new version of our xSPI family of STT-MRAM products from 4 megabit to 128 megabit that extends the operating temperature from industrial temperature, that is minus 40C to 85C to extended temperature, which is minus 40C to 105 degrees C. We exceeded expectations on our radiation hard programs to deliver STT-MRAM-based solutions for a high-density memory array and a distributed configuration memory for instant on FPGAs with multiple time programmability. For our business outlook, our product backlog for balance of 2023 and into 2024, as of June 30, 2023, continues to be high, although we are experiencing some headwinds from the semiconductor downturn. We continue to alleviate some of our foundry supply chain constraints, which is helping us address our unfulfilled Toggle demand. Over the past year, Everspin has introduced 2 xSPI family of STT-MRAM products integrated on 28-nanometer CMOS with the densities ranging from 4 megabit to 128 megabit. These products are available in the industrial temperature range of minus 40C to 85C. These products will enable our customers to simplify their system architecture and easily replace legacy memory components like SRAM and FRAM. Based on customer feedback, we are now planning a new family of xSPI STT-MRAM products with densities from 4 megabit to 128 megabit for the standard temperature operating range of minus 40C to 105C. This enables our customers in all segments to use these parts in harsher environmental conditions. Engineering samples are available now upon request and will be available in production volumes in Q4 of 2023. As discussed in the last earnings call, Everspin is designing a high density, which is greater than 256 meg. STT-MRAM discrete product for discrete NOR Flash replacement. The first product in this family of 1 gigabit density is on schedule for 2024 tape-out and for engineering samples. This family of products would be ideal for replacing NOR and FPGA systems to store configuration memory and simultaneously enabling 100x faster over-the-air updates. Everspin has added fine beam etch capability to its 8-inch STT-MRAM line in Chandler. We are excited about this capability as it enables Everspin to develop the next-generation MTJ material stack and etch process. This capability will reduce the development cost and our time to production when our MTJ process is transferred to our partner's 12-inch line on advanced CMOS nodes. At present, this ion beam etch tool is being used for our Radiation Hard STT-MRAM programs and is yielding promising results. As you know, Everspin has 2 active Radiation Hard programs to deliver STT-MRAM solutions: one, a high-density memory array; and two, a distributed configuration memory for instant on FPGAs with multiple time programmability. As it relates to the STT-MRAM portion of this project, Everspin met its obligations and the delivered solution exceeded the specs defined for the FPGA. This included a demonstration of the integration scheme and the MTJ stack for the STT-MRAM solution and the performance of the Everspin circuit design. In the next phase of the project, this solution will be integrated on CMOS wafers with the FPGA fabric and optimized for performance. This design is a revolutionary approach that enables distributed STT-MRAM as a configuration memory in FPGA plus extending MRAM in a new application use case. I will now turn it over to our CFO, Anuj Aggarwal, who will take you through our second quarter financials and third quarter 2023 guidance. Anuj?