Thanks, Steven. Hello, everyone and welcome to ACM Research first quarter earnings conference call. We've just completed another important quarter, not only in terms of performance, but also in how we are advancing our position in this global semiconductor industry. Before I review the results, I would like to highlight a few recent developments and reflect the momentum we are building and the direction we are heading. We were pleased to see ACM Research recently appeared on the list of the Top 20 Global Semiconductor Equipment companies for 2024 as published by a leading third-party market research firm. That recognition reflects the steady progress we have made over the year and the growing impact of our innovative products. In China, we estimate our market share in both wafer cleaning and cleaning reached more than 25%, which translates to more than 9% global for each product category. This speaks to their trust, we have earned from leading customers and also strength of our product portfolio. Our panel level packaging tool received the 3D InCites Technology Enablement Award. As a reminder, Panel Level Packaging is a next generation solution for high performance AI chip packaging. This award is yet another great validation of ACM commitment to delivering innovative and enabling technology to our customer. At the same time, we're all aware that global trade environment is shifting. With new tariffs and evolving policies, we are operating in a more complex and less predictable environment. In this new period, we think the strategy we set forth many years ago, develop world class tools, established R&D and production in key countries where major semiconductor customers are located, and focused sales effort on the global market becomes even more important for our future success. ACM is a U.S. company with deep operational strength in Asia. We're in a unique position. We have rebuilt a successful business in Asia by delivering world class tools. As a multi-product company, we're expanding our tool offering to better support our customer in Asia. We are now taking important steps to expanding our business into global market. In the U.S., we are investing in Oregon facility, starting with the Class 100 clean room for wafer demo and R&D activities. And we're laying the groundwork for initial production capacity in our Oregon facility. We currently believe this is the best way to reduce tariff uncertainty for the U.S. customer, and it is also a good business to establish production close to a customer. We believe that ACM position as the only U.S. company with a full top to bottom cleaning product line combined with Technology Lab and the commitment to production in Oregon put us in a good position to take on the global market. Now onto our business results. Please turn to Slide 3. For the first quarter of 2025, we delivered revenue of $172 million, up 13% over year. Shipment were $187 million down 36%. We know that shipment in Q1 of 2024 was especially strong due to customer demand. So this was another -- this was a tough comparison. We anticipate a return to year-over-year shipment growth in the second quarter. Gross margin was 48.2%, exceeding our targeted range of 42% to 48%. We ended the quarter with a net cash of $271 million, up from $259 million at the year-end 2024. Now I will provide detail on product. Please turn to Slide 4. Revenue from single wafer cleaning, Tahoe and semi critical cleaning tools grew 18% and represented 75% of the total revenue. Growth was led by strong demand for our SAPS and [indiscernible] platform as well as continued momentum for the Ultra C V backside cleaning tool. In Q1, we qualified our high temperature SPM tool with a leading logic customer in China and achieved customer acceptance for our back end bevel edge tool from our U.S. customer. Looking ahead in cleaning, we expect to see strong product cycle across high temperature SPM, Tahoe and other cleaning segments. We believe our top to bottom cleaning portfolio put us in a strong position to continue gaining share both in China and expanding to global market. Revenue for ECP, furnace and other technology grew 7% and represent 16% of total revenue. We saw strong momentum in ECP tool for advanced packaging and we are excited about their initial response to our new Ultra ECP ap-p tool. As mentioned before, ACM Ultra ECP ap-p panel level plating tool received the 2025 3D InCites Technology Enablement Award in the United States. We believe ACM is the first and only supplier to offer rotating horizontal plating approach for the panel level packaging. The industry is now aggressively migrating from wafer level packaging to panel level packaging as one of the leading solution for the next generation of AI chips. The reason is simple. You get a better utilization with a square panel versus a circular wafer. As a result, we now experienced a lot of interest from several major player in the industry. This product highlight ACM technology leadership in both front end processing and advanced packaging applications. We believe this will allow us to play a key role as global industry demand innovations to support even involving semiconductor requirements for AI. Our furnace product continue to gain traction. Our view is that market is increasingly demand high temperature annealing solution, particularly for power semiconductor IGBT devices. Our UltraFN vertical furnace tool is a proprietary quartz based design that reach temperature of up to 1250 degrees C without distorting the wafer surface. We believe no other supplier currently achieve this temperature level in a vertical platform, and this is yet another good example of ACM technology leadership. We expect our revenue contribution from our furnace product line, including LPCVD, oxidation and ALD to accelerator meaningfully in 2025, expanding from a relatively small base in 2024. Revenue from Advanced Packaging, which excludes ECP, but including service and the spell, was down 10.5% and representing 9% of revenue. We are making good progress with the new Track and PECVD platforms. Both of these products come with ACM innovative and differentiated platform, designed that allow for process flexibility and high throughput. We had a solid list of ongoing demonstration and evaluation for both Track and PECVD. For Track, we plan to deliver our 300WPH inline KrF beta tool in middle 2025. For our new platform, Track and PECVD, we expect some initial revenue contribution in 2025 with more in 2026 and beyond. To wrap up to the product, we have been on a strong growth path for the past five years with new products including Tahoe SPM and the furnace in 2025 followed by our panel level packaging tools, Track and PECVD in 2026 and beyond. We remain committed to a high growth model for the next five years. As a reminder, our $3 billion long-term revenue target anticipated $1.5 billion from China and $1.5 billion from the global markets. Next, let me provide update on our production facility. First is the Lingang. Please turn to Slide 8. Our state-of-art Lingang Production and R&D Center is nearly completed. The site including two production buildings with the first now in production and the second available for future expansion. Each of the two production buildings can support up to $1.5 billion of their annual production capacity. Combined, we believe we can eventually support $3 billion of the production at Lingang. Next, our Oregon facility, please turn to Slide 8. As I mentioned before, we are investing in our U.S. footprint. Our Oregon facility is 40,000 square feet. We are building out a demo lab and a clean room and plan to add initial manufacturing to support our global customers. Now, I will provide our outlook for the full-year 2025. Please turn to Slide 10. We are maintaining our 2025 revenue outlook in a range of $850 million to $950 million. This implies 15% year-over-year growth at the middle point. In closing, our focus remains on delivering differentiated enabling technology that will solve our global customers' most critical process challenges. Now let me turn the call over to their CFO, Mark, who will review details of our first quarter results. Mark, please.