Thanks, Gary. Hello, everyone. And welcome to ACM Research third quarter 2024 earnings conference call. Please turn to slide 3. For the third quarter, revenue was $204 million, up 21%. Shipments were $261 million, up 23%. Profitability was good with a gross margin of 51.6% and operating margin of 27.5%. And we are ending the quarter with approximately $369 million of cash and time deposit with a positive cash flow from operations for the quarter. Revenue for the first nine months of the year was $558.6 million, up 44%. Year-to-date shipments were $709.7 million, up 56%. We believe this growth is significant, demonstrate market share gain for ACM and their contribution from new product cycle. Now I will provide the detail on product. Please turn to slide 4. Revenue from single wafer cleaning, Tahoe and semi-critical cleaning product grew 22% in Q3 and represented 79% of total revenue. ACM offer comprehensive top to bottom cleaning portfolio. We estimate the global total available market, or TAM, for the cleaning is close to $6 billion, and ACM products are probably more than 90% of all cleaning process steps in both memory and their logical manufacturing. [indiscernible] in sulfuric acid peroxide mixing, or SPM, have led to increased confidence toward our target for continued market share gain in cleaning. As a reminder, we estimate SPM process represent about 25% of total front-end cleaning market, but so far it has been a small contributor to our business. During prior report, we announced a technical progress in our high temperature SPM solution. Recall that only one other major cleaning tool supplier services the high temperature market for SPM. During our first quarter call, I reported a technical break that could enable us to be the second player. We are now in later stage evaluation at a number of key customer, and we are committed to become the second supplier in the world supporting commercial high temperature SPM cleaning. That's not all. Today, we issued a press release marking a major performance breakthrough for Tahoe, ACM's environmental solution for the middle and low temperature SPM segment. The Ultra C Tahoe now achieve the performance of a standalone single wafer cleaning tool on low to high temperature SPM process. The Tahoe platform advanced cleaning capability have achieved average particle count of less than 6 particle at 26 nano size, meeting the stringent requirement for the advanced node manufacturing. The tool is also capable of removing YX nanoparticle for the most advanced logic memory applications, with additional of a smaller particle filtering system. Tahoe's patented hybrid architecture is among the first in the industry to combine batch wafer process and a single wafer cleaning chamber into the same SPM tool. The hybrid architecture deliver enhanced cleaning performance, high throughput and process flexibility with up to 75% reduction in chemical consumption. ACM estimates cost savings of up to $500,000 per year from sulfuric acid alone, with additional environment and cost benefit from reduced sulfuric acid and treatment and disposal. With the rise of AI to the forefront of the consumer mind, we expect to increase public attention on the environmental impact of semiconductor chip manufacturing. We believe ACM Ultra C Tahoe is well positioned to help customers increase production of advanced AI chips, but with reduced footprint on the environment. Put another way, Tahoe is good for customers and good for planet. We believe Ultra C Tahoe is another example of excellency from ACM innovation and the world class R&D team, and demonstrates how innovation can achieve the information economy and the protected environment. We also announced today that the upgraded Ultra C Tahoe is now in mass production at several high volume customer facility in China, and under evaluation at an additional logic and memory customers. We expect to deliver more units by end of year. The market opportunity for Tahoe is quite large as the middle and low temperature is more than 80% of their SPM market and thus about 20% of their overall cleaning total tools market. We believe ACM cleaning portfolio, including SAPS, TEBO, Tahoe, semi-critical, together with SPM and super-critical CO2 drying, put ACM in world class status. We see good opportunity for continued market share gain in mainland China, and we are confident we have what it'll take to secure major customer in international market. Revenue from ACP furnace and other technology grew 36% in Q3 and represent 17% of total revenue. Momentum for our plating tool remains solid for both frontend and backend tools. I'm pleased with the revenue performance. I also noted that shipment for the ACP furnace category grew by 67% year-to-date. Our furnace product cycle is also gaining traction with other memory and analogy customers. Overall, we now anticipate of having 17 furnace customers by the end of this year, up from the nine at the end of last year. We expect a contribution to revenue from furnace to accelerate in 2025. Revenue from advanced packaging, which excludes ECP, but includes service and spares, declined by 21% for Q3 and was up 3% year-to-date and represented 4% of revenue. This category including a range of packaging tools, including coder, developer, scrubber, PR stripper, and web etchers, and also service and spare parts. And we are exploring new products and technologies to participate in the next generation of advanced packaging. We believe ACM is one of the only companies that offers a full set of web tools, cover plating tool, and a polish tool for advanced packaging. Year-to-date growth of advanced packaging was low. We attribute this to slower growth for China-based packaging firms who are more exposed to a broader end market trend. We also know this category does not include our ECP tool for the advanced packaging. In early September, we announced purchasing orders for four wafer-level packaging tools from US customer and US R&D centers. These tools are scheduled for delivery in the first half of 2025. We are very optimistic about our fan-out panel level packaging tools. We have recently announced three panel-level packaging tools, including vacuum flux cleaning tool for Chiplets, the horizontal plating tool, and the bevel edge tool. These three new panel tools make a strong offer by ACM to address advanced panel-level packaging market. We have been developing this technology for years, and I believe the market is now coming to us. Our technology is applicable to [indiscernible] high temperature or high density packaging. This is especially relevant to AI packaging of a GPU at a high density, high bandwidth memory, HBM. We see a large global opportunity as several major American leaders are choosing panel for their AI chip packaging solution. Finish up on the product. We are making good progress with our track and the PECVD platforms. Both of these products have innovation, a differentiated platform design, and allow for process flexibility and high throughput. We have a solid list of ongoing demonstration and evaluation for both track and PECVD. We expect further progress for both PECVD and track over the next year, with the revenue likely in later 2025 and more and more contribution in 2026 and beyond. Moving on to the customer. Please turn to slide 7. In Q3, we saw broader demand for foundry logic, power, and memory. We had a full 10% customer for the period represent 63% of the revenue. In China, we have a leading position in cleaning and target additional market share gains. We believe we have become a world-class multi-product company with a competitive product in the market for plating [indiscernible] and we have a solid evaluation pipeline for track and PECVD. In the US, we're continuing to make steady progress. I already mentioned the order for four WFE tools scheduled for delivery in 2025. In addition, activity with our major US customer continues to progress. Both of our SAPS tools have already achieved supplier qualification, and we have moved to the production qualification process. And the backside of the bevel edge tool [indiscernible] of this year, is in the later stage of a supply qualification. In Europe, we are also in the later stage of a qualification of Ultra C SAPS 5 cleaning tool, which we deliver to a major global semiconductor manufacturer in Q3 of 2023. In Korea, we remain engaged with the customer for a range of tools. To support the goal, we made a progress on our facility expansion in China and other region. Please turn to slide 8. In China, on October 20th, our subsidiary, ACM Shanghai, hosted an opening ceremony for the Lingang production and R&D center that are gathering employees, customers, supplier and local officials. The first of two modern manufacturing floor including state-of-the-art of automation system [indiscernible] initial operation. During the third quarter, we also moved into the new ACM Shanghai headquarters. The facility is also in the Shanghai high tech