Thanks, Steven. Hello, everyone, and welcome to ACM Research second quarter 2024 earnings conference call. Please turn to Slide 3. For the second quarter revenue was $202.5 million, up 40%. Shipments were $203 million, up 32%. Profitability was good with a gross margin of 48.2% and operating margin of 25.6%. And we ended the quarter with approximately $367 million of cash and time deposits with a positive cash flow from operation for the quarter. Revenue for the first half of the year was $354.7 million up 62%. We believe this growth rate is higher than the growth rate of China WFE and demonstrates market share gain for ACM and the contribution from new product cycles. Now I will provide detail on products. Please turn to Slide 4. Revenue from single-wafer cleaning Tahoe and semi-critical cleaning product grew 36% in Q2 and represented 76% of total revenue. ACM offers what we believe is among the industrial most comprehensive cleaning portfolio. We estimate the global total available market or TAM for cleaning is close to $6 billion and ACM produce products supporting 90% of all cleaning process steps in both memory and the logic. During the last earnings call, we highlight the sulfuric peroxide, or SPM portion of the cleaning market, which has been a relatively small contributor to our business, but represented 25% to 30% of the total front-end cleaning market. ACM now offer full product line of SPM tool across all temperature range. We have already shipped Tahoe and single-wafer tools for lower and middle-temperature SPM steps. We now have a differentiated high temperature SPM tool that we believe position us to gain market share from the current market leader. We currently have more than 10 SPM customers in production or evaluation and look forward to increase contribution to shipment or revenue as we ramp up production in the next 12 months to 24 months. We also expect our bevel etcher cleaning tool to contribute more revenue in 2024 and we are on track to complete evaluation of a supercritical CO2 dry cleaning tool this year, and the revenue in 2025. We believe ACM cleaning portfolio, including SAPS TEBO Tahoe semi-critical, together with SPM and supercritical CO2 dry, has achieved world class status. We see good opportunity for continual market share gain in Mainland China. And we are confident, confident we have what it takes to scare major customers in the international markets. Revenue from ECP furnace, and other technology grow 104% in Q2, and represent 19% of total revenue. We achieved another quarterly record in this category with nearly $39 million in revenue in Q2. In plating, we are seeing strong demand for both front-end wafer processing and back-end packaging. We have a major new product announcement today, the Ultra ECP ap-p plating tool for the next generation fan-out panel-level packaging, or FOPLP. We believe this is a game-changing that position ACM to participate in growing demand for AI solutions. Our proprietary design employs a horizontal plating method that delivers film uniformity and precision across the entire panel. We believe ACM is among the first to employ horizontal plating for panel application, and it will strengthen the market, enabling advanced packaging with some micron feature on large panels. This technology is especially applicable to GPU and high-density, high-bandwidth memory HDM. We see a large opportunity as several major semiconductor leaders have chosen panels for their AI chip packaging solutions. And we continue to make good progress with our furnace products, which address more process steps, ranging from oxidation, anneal, to LPCVD and ALD. As noted in prior call, our furnace product cycle is about 18 months behind plating. We believe our furnace product portfolio will benefit from increasing capacity for both memory and logic. Overall, we expect to have more than 16 furnace customers by end of this year, compared to the nine at the end of 2023. Revenue from advanced packaging, which includes ECP, but including service and spare, declined by 20% for Q2, but went up 13.5% for the first half of the year. This category includes a range of packaging tools, such as a coater, developer, scrubber, peer stripper, and wet etchers, and also service and spare parts. And we are exploring new product and technology to participate in the next generation of advanced packaging. We believe ACM is one of the only companies that offers a full set of web tools, polished tools, and carbon plating tools for advanced packaging. Last week, we announced the Ultra C vacuum-p flux cleaning tool for fan-out panel-level packaging. This is a convenient tool to the ECP ap-p, which I mentioned earlier, and extending ACM product portfolio to the panel space. In July, we shipped our first Ultra C vacuum-p flux tool to a new China packaging manufacturer. Putting it together, we believe those two panel tools, including plating and cleaning, mark a strong offering by ACM to address a fan-out panel-level packaging market. We believe ACM is among the first to apply horizontal plating technology into panel packaging application. And we believe our technology will help accelerate ACM's global market share gain as the interest in panel-level packaging is growing rapidly at Foundry, IDM, and OSAT in the US, Korea, and Taiwan, and mainland China. Finishing up on product, we are making good progress with our track and PECVD platform. We believe our proprietary approach positions both tools for success for Mainland China and the global customer. We shipped our beta version of PECVD tool in July to a large customer. The innovative platform is capable of handling a wide variety of the PECVD process. We expect multiple evaluation this year and a number of our local customers in Foundry, logic, and memory, and other areas. We are moving forward in the development of our track tool which has differentiated design with a focus on high throughput and low maintenance. In addition to AI evaluation tool in a major Chinese foundry, we are also engaging with several customers for i-line and KrF-line based lithography. We expect good progress for both PECVD and track over the next year with revenue likely in later 2025 and more notable contribution in 2026 and beyond. Moving on to customer. Please turn to slide 7. In Q2, we saw broader demand from foundry logic power and memory both NAND DRAM. For the second quarter of 2024, we had a full 10% customer representing 58% of the revenue versus three customers representing 52% in the second quarter of 2023. In China, we have a leading position in cleaning with significant room to grow. We believe we have become a world-class multi-product company with competitive products in markets for plating and furnace. We have a solid evaluation pipeline for track and PECVD. Overall, we believe our China growth is being driven by the market share gain new products and increased localization. In the US, we deliver Ultra C b backside cleaning and Bevel Etch tool in the second quarter of 2024 to a large US manufacturer that qualified as the first SAPS cleaning tool for revenue later last year. This demonstrates a deepened relationship which we believe can lead to a production order across multiple product lines. And today, I'm pleased to announce we have received an order from US-based wafer level packaging house for a coater/developer tool. We expect to deliver this tool to the US facility in the first half of 2025. Last month, we had a greater week at SEMICON West trade show in San Francisco. We had several days of solid meeting with a number of US chipmakers with fabs in US and abroad with good interest in our SAPS TEBO Tahoe supercritical CO2 dry plating, and all wet etch tools. In Europe, we are in the final stage of our qualification of Ultra C SAPS cleaning tool at a major global semiconductor manufacturer. In Korea, we engaged with multiple customers for both front-end and packaging tool, including single wafer and batch cleaning Tahoe ECP furnace ALD PECVD and track. We see opportunity for our tool with SK Hynix high bandwidth memory capacity product. To support, growth we made progress on our facility expansion in China and other regions. Please turn to slide 8. In China, our Lingang production and R&D center is nearly complete. We expect initial production to begin in the second half of this year. In Korea, we believe a strong commitment can improve our relation with key Korean customers. Our resources in Korea can also provide another basis to support international customers. We continue to invest in our Oregon site to add our service support and demonstration capability for R&D and customer activity in the U.S. and Europe. In Q3, we entered into an agreement to purchasing a 40,000 square feet R&D facility in Oregon, with a full functional 5000 square feet clean room. The purchasing is scheduled to close in Q4. This new facility demonstrates a strong commitment to the US market allow us to conduct R&D and demonstration of ACM technology near major semiconductor producers. Several years ago, we set a long-term revenue target of $1 billion. We are now closing to this level and we have made good progress with new product and international marketing. As a result, I'm happy to report that today we have set a new long-term revenue target of $3 billion. Please turn to slide 6. Key reasons for increasing include; first, we have scaled our business in Mainland China and also Korea. We now ship cleaning plating and advanced packaging tool to nearly all the major and smaller semiconductor manufacturers, and we are amongst the top one or two local producer for each category. Second, we believe our products are world-class cost this including our current offering and our new products roadmap. We are committed to innovation and we believe we can compete head-to-head with top tier players both in China and international market. At a high level, we believe a marked shift to AI is moving the market towards ACM technology warehouse. We have been investing in key technology for years, and we are now seeing good interest to apply key technology to several industrial trends. Let me highlight a few. The shift to 3D structure for NAND, DRAM and logic is driving demand for our vertical cleaning solutions including, TEBO and supercritical CO2 dry and also our proprietary furnace ALD design. Next, HBM requirements are driving demand for our TSV plating and 2.5D advanced packaging solutions. For PECVD, ACM has a very unique approach including, one chamber with three chucks that allow our customers to address multiple processes with the same platform. For track, ACM differentiated platform is designed for high throughput and low maintenance to scan. And therefore, panel plating as we announced today, we believe ACM new, Ultra ECP ap-p is a game changer that will support future AI chip packaging at the panel level. Third, with our product line proving at a scale in China and Korea, we are seeing good traction with our global customers. We have a multiple tool under evaluation at several major customers in US, European, Korea and Southeast Asia. We are confident those can lead to volume production orders. In the longer term, we expect up to half our business in market beyond Mainland China. Bringing it all together, our $3 billion target assuming that China will account for about $1.5 billion revenue and the rest of the world, which is 2x to 3x larger than China will account for another $1.5 billion. I will now provide our outlook. Please turn to Slide 9. We have raised our 2024 revenue outlook to a new -- to be in the range of $695 million to $735 million versus prior outlook of $650 million to $725 million. At the midpoint, our new outlook represents 28% year-over-year growth compared to 23% previously. We expect shipment in the second half of the year to grow with a full-year shipment growth rate, outpacing revenue growth rate. We note our visibility for the year is largely driven by our current order book, anticipated new orders qualification or customer acceptance of the previous shipped evaluation tool to a range of customers. We believe WFE's spending in mainland China will remain stable, as the country continue to -- on its goal to match its production capacity with end market consumption. We are focused on gaining market share in Mainland China, ramping our new products and expanding our business to new customers in the US, Korea, Taiwan, Europe and other Southeast Asia markets. Now, let me turn the call over to our CFO, Mark who will review details of our second quarter results. Mark, please?