Thank you, Alison. Good afternoon everyone and thank you all for joining our second quarter 2024 conference call. We have made tremendous progress during the first seven months of 2024. Unfortunately, that progress is overshadowed by some scheduling push-outs that cause us to lower our full-year growth projection to 15%. As Elias will cover in detail, we anticipate revenue in Q3 will be up slightly from Q2 followed by a very sharp rebound in Q4 to realize our revised full-year growth projection. I will step you through the status of our major contracts, but first I want to make a few things absolutely clear. We did not lose any of the contracts to competitors that we expected would contribute to the 30% growth. And none of the push outs were due to delays caused by QuickLogic. We are performing on or ahead of schedule on all contracts and pending proposals. We also have deliverables scheduled to support the majority of the implied revenue outlook for Q4. Only one of the push-outs involves a significant contract that we’ve discussed in our quarterly conference calls. I will cover that to the extent I can as I update you on the status of major contracts. The balance of the push-outs are smaller deals that we believe will generate revenue beginning in early 2025. I say beginning in 2025 because most of the IP contracts have the potential to generate revenue for years beyond the IP deliverables phase. As I’ve noted in past calls, the IP deliverables phase, which has driven high growth and record profit margins, is actually the foundation for our larger business model. We expect IP revenue will rebound sharply in Q4 of this year and that demand, from an expanding base of customers, will accelerate revenue growth going forward. In addition, we believe revenue from our next phase, which includes Storefront and Chiplet, will layer on beginning in late 2025. Let’s take a few minutes now to update the status of some of our major contracts and accomplishments. On July 8th, we announced the award of the third tranche of the Strategic Radiation Hardened FPGA government contract that was initiated in August 2022. The value of this tranche is $5.26 million, and as we forecasted in our last two conference calls, it has a funding rate similar to tranche one. The higher than anticipated cash usage during Q2 is mostly attributable to the timing of our Strategic Radiation Hardened contract. As Elias will cover, the payments received in Q3 that we anticipated in Q2 will benefit Q3 cash flow. Tranche three funds the continued development of Strategic Radiation Hardened FPGA technology to support identified and future DoD strategic and space system requirements. The total potential for this contract, including future options, is $72 million. If these options are exercised, we expect the funding rate will increase significantly in 2025. Beyond building on the success of our large government contract, we are very well positioned to significantly expand our eFPGA Hard IP business across many new customers and market sectors, as well as the number of fabrication nodes supported by our IP in 2024 and beyond. With the award of Tranche Three, we moved $5.26 million from our sales funnel to booked business, and more than replaced it with new opportunities. The result is a net increase to $189 million. Within this, there are numerous outstanding proposals including three new RFPs with major customers totaling approximately $8 million that we have submitted during the last month alone. Given its two-year outlook, the funnel is also beginning to capture specific Storefront and Chiplet opportunities that we believe will begin to materialize late in 2025. On June 18th we announced that we joined the Intel Foundry's Accelerator IP and US Military, Aerospace, and Government Alliances. This marks a significant milestone in the company's strategic growth plan. Driven by customer demand and to capitalize on the already considerable interest from companies targeting the Intel 18A technology for new designs, we have initiated development of our Hard IP. We believe this will position QuickLogic as a leading source for eFPGA Hard IP optimized for Intel 18A. Combined with the unique ability of our Australis eFPGA Hard IP Generator to quickly develop customer-defined Hard IP cores, we will be well-positioned to win contracts and accelerate the schedule of our deliverables. On May 28th we announced that QuickLogic received the BAE Systems Partner 2 Win Supplier of the Year award in the category of FAST Labs Technology Innovation Partner of The Year. During our last conference call, I announced that we booked our second contract that will be fabricated using a nanometer process. The first contract is with a Defense Industrial Base customer and will be fabricated on GlobalFoundries 12nanometer process known as 12LP. We are on schedule to complete our deliverables on two cores and recognize revenue during the second half of 2024. The second contract is with a large international company that I’m sure you would recognize. This design is for a new ultra-low-power SoC that is targeting a variety of commercial and industrial IoT applications. This design will be fabricated by TSMC on its 12 nanometer process. Within the SoC, our eFPGA technology is used for AI acceleration, which is a necessary function in most AI applications. We believe this will prove to be a rapidly growing application that is often better served by eFPGA technology than a processor running the acceleration algorithms in software. We are on schedule to complete our deliverables for this core and recognize revenue during the second half of 2024. We are also working closely with this customer on a new design proposal. In November 2022, I shared that we taped out a new device for a customer that incorporates our eFPGA Hard IP. Due to strict confidentiality requirements, I can't share more details on the specific design win beyond a brief update. In line with what I covered during our last conference call, the customer is continuing to work through certain aspects of the design. Last quarter I stated that we anticipated resuming our efforts on this design during the second half of 2024. However, due to a delay with one of the customer’s subcontractors, the completion of our deliverables and revenue recognition have been pushed out to 2025. The program is still a solid go and could represent tens of millions of dollars in potential Storefront revenue starting in a couple of years. Last September, we announced a leading technology company chose our eFPGA Hard IP for a design that will be fabricated using GlobalFoundries 22FDX platform. Again, due to strict confidentiality requirements, I cannot go into more detail on the design, but I can share that we have delivered our IP to the customer that is now awaiting the availability of a multi project wafer shuttle at GlobalFoundries to move forward. Last November, we announced a global semiconductor leader chose our eFPGA Hard IP for a design that will be fabricated on UMC’s 22 nanometer process. We have completed the delivery of our IP. Tape out was also completed on schedule and the customer expects delivery of its first chips during Q3. In total, we are on contract to deliver our eFPGA Hard IP on six different foundry/process technology combinations, including two that will be fabricated using 12 nanometer technology. In addition to these, we believe we are on track to be a leading company to offer eFPGA Hard IP for Intel 18A. In advance of this, we have submitted the first two of what we believe will be many proposals to customers targeting new designs for Intel 18A. This is up 3x from a year ago with minimal growth in the associated R&D costs. This demonstrates that the market demand for eFPGA Hard IP is accelerating and that the automation from our proprietary Australis IP Generator enables us to address this demand in a scalable way. We expect this trend to continue with our leverage becoming even more evident as we increase our 18A engagements. In addition to these awarded contracts, we have a number of large contract proposals pending; some of which have a value in the mid-seven-figures. These include major DIB proposals and a pending new proposal with a large semiconductor company. Some of these proposals could end up as Storefront designs. In addition to these, we have several Chiplet opportunities in our funnel including potential deals with our partner, YorChip. We are awaiting feedback from customers on two previously discussed proposals that have a combined value of over $40 million; one is in conjunction with YorChip. We’re very excited about our partnership with YorChip and the pending release of our first jointly developed FPGA Chiplet integrating QuickLogic IP in second half 2025. Going forward, this FPGA Chiplet product line will be expanded to include devices ranging from 40,000 LUTs to over one million LUTs. These Chiplets will include a UCIe interface, which is supported by industry leaders including AMD, Arm, Google Cloud, Intel, Meta, Microsoft, Qualcomm, Samsung and TSMC. We believe this will enable the rapid adoption of our FPGA Chiplet solutions across a very wide variety of applications. In line with our earlier forecasts, shipments of EOS S3 to our lead smartphone customer increased during the first half of 2024. Q3 will be a seasonally low quarter with volume rebounding in Q4. With new designs ramping, we expect shipments will continue through 2025. Consistent with our prior outlook, we are forecasting a modest increase in display bridge shipments and we now believe mature product revenue will also be up modestly year-over-year. During July, we announced two new distribution agreements; one with Spur Microwave to cover markets across India and the second with Astute Electronics, which covers Europe, Israel, Turkey, Australia and New