Thanks, Dan, and thank you for joining our earnings for the third quarter of fiscal '25. I'll start with an overview of our third quarter results and then discuss our outlook. Following my comments, our CFO, Dan Flemming, will provide Q3 financial details and our guidance for the fiscal fourth quarter. For the third quarter, Credo reported revenue of $135 million, up 87% sequentially and up 154% year-over-year. Credo's non-GAAP gross margin was 63.8%. Credo achieved record revenue in Q3 as we saw the expected inflection point in our business. This ramp was led by our largest hyperscale customer as they scale production of AI platforms. Additionally, we received solidified forecasts and saw increased design activity for our products with additional hyperscalers and other customers, as the performance, reliability and power benefits of our connectivity solutions have become increasingly clear throughout the industry. In a world where data drives everything, the demand for faster, more reliable and energy-efficient connectivity continues to expand rapidly. Key to Credo's competitive advantage is our multi-tiered innovation, which enables us to deliver a broad set of optimized solutions that are tuned at every level. The first tier of innovation is in our SerDes technology. Our SerDes technology is purpose-built to tackle the toughest bandwidth challenges, balancing speeds up to 200-gig per lane with exceptional performance and power efficiency. By leveraging advanced signal processing and a programmable design, we've created a flexible architecture that adapts to the unique needs of AI workloads, whether it's long reach data center links or ultrashort connections in dense compute environments. The second tier of innovation is in our integrated circuit design, our IC designs, including retimers, DSPs and chiplets are engineered to deliver the best combination of performance, power and cost for a given application. Our LRO DSP is a great example of innovation on the customers' behalf to deliver a compelling IC solution optimized for power efficiency and optical links. The third tier of innovation is our system-level approach. We don't stop at chips. Our best example of system-level innovation is Credo pioneering the active electrical cable market. By taking accountability for the system-level solution, we raised the bar to deliver end-to-end connectivity solutions that go beyond industry standards to deliver unique functionality and best-in-class reliability. We see this system-level approach, creating a larger opportunity for Credo with the emergence of AI clusters due to the intense demand for reliability and power efficiency. Finally, wrapped around each tier of innovation is our development and diagnostics software and firmware platform to deliver predictive signal integrity, link optimization and tuning. From the SerDes to the system level, this software platform helps our customers navigate system development to achieve best performance, yields and reliability. As we look forward, we'll expand our solutions to the PCIe protocol with the same ingenuity that creates our differentiated Ethernet solutions. With the introduction of a full suite of PCIe products on the near-term horizon, Credo will soon be addressing a larger connectivity opportunity with AI scale out and scale up networks, substantially expanding our overall TAM. Now I'll discuss our business in more detail. Regarding our AEC product line. As expected, our revenue served in the third quarter, driven by our largest hyperscale customer. Compared to alternatives, the benefits of AECs have become clearer. More than ever, data centers are highly focused on back-end network reliability. With billions of hours operating in the field, AECs have become the de facto standard for intra-rack connections for NIC to TOR and switch to switch applications. However, we are now seeing a new expansion of AEC usage. Our