Thank you, Claire, and good afternoon to everyone on the call. Today, we are pleased to report record quarterly revenue of over $52 million, which reflects 10% sequential growth from Q2 and approximately 50% growth over Q3 of last year. Our ATS business was a primary driver of our growth in Q3 with sales up 18% sequentially and 57% year-over-year, reflecting the continued momentum we are gaining with multiple key customers in 2022. Wafer Services sales were similar to Q2 and up 36% year-over-year. With quarterly revenues now exceeding the $50 million level, our gross margin performance in Q3 demonstrates that we are delivering significant flow through to margins and profitability on the incremental revenue we've achieved since Q1. As we've been communicating all year, with ATS being the driver of our incremental revenue growth, our revenue flow-through to gross margin is well above 50%. In fact, we significantly exceeded our gross margin forecast for the quarter, as Steve will detail in his prepared remarks. We also have been communicating each quarter this year that the improved pricing terms with our legacy wafer services customer raised our quarterly revenue baseline from which to grow, and we have been delivering on sequential quarterly improvements in revenue despite the weakening macro environment. With our strong performance in Q3 and current outlook for Q4, we expect we will achieve or exceed our long-term revenue growth target of 25% this year. We are very pleased with the progress made in Q3, achieving sequential improvement in our revenue pipeline, increasing fab efficiency and output and significantly improving gross margin. A highlight of Q3 was not only did we turn the corner to generate positive adjusted EBITDA, but it was a very healthy $3.8 million equal to 7% of revenue. With this level of performance against our stated objectives this year, we are delivering on our promises for better predictability in our results, increased visibility and more consistent execution towards our stated financial and business objectives. Since our last call, we've made several important announcements that build upon the momentum we've been gaining throughout 2022, strengthening the foundation for consistent quarterly revenues above the $50 million level and further establishing SkyWater as a critical player in the future of our country's semiconductor supply. These important announcements included the Rad-Hard Phase 2 award progress on multiple fronts towards CHIPS Act funding for the Purdue fab and other growth projects, the Build Back Better Regional Challenge award funding our expansion in Florida as well as a number of important partnerships and collaborations announced with Google, the National Institute of Standards and Technology, NanoDx, Trusted Semi and more, which brings me to a discussion on our primary strategic growth areas, starting with extreme environment microelectronics. Throughout 2022, we have been reporting on the progress and achievements in our Rad-Hard program, with the ongoing successes in Phase 1 leading up to the anticipated Phase 2 award. On our August earnings call, we indicated that the Phase 2 award was imminent, and we are pleased to make this important announcement in September. Valued at nearly $100 million, this award demonstrates the competitive strengths of RH90 platform and the commitment of the DoD to continue its significant investment in SkyWater as we successfully execute the program. This award funds the productization and qualification phase, which will continue for the next two years leading up to volume production. Like the additional Phase 1 award announced last quarter, the Phase 2 award has been funded and launched and was a significant driver of our sequential revenue growth in Q3 as well as the additional more modest uptick in sales expected in Q4. Last quarter, I focused on several aspects of the RH90 platform that make our technology the strongest option available for strategic extreme environment applications. During the RH90 base program phase, we work with our partners to firmly establish key components of the growing RH90 ecosystem. This included an initial PDK, a multi-project wafer, or MPW shuttle capability, coupled with our early access partner program and the engagement with IP providers to develop SRAM compilers and the embedded FPGA IP needed to make designing and RH90 more efficient for our partners. The next phase is a rigorous effort that includes radiation and reliability testing and further development of IP design libraries that will enable our design and manufacturing ecosystem partners to produce processors, security engines, memory devices interface ASICs and other mission-critical strategic solutions. Last month, we were pleased to host Congresswoman Betty McCollum and the DoD's Undersecretary of Defense for Research and Engineering, Ms. Heidi Shyu, at our headquarters in Bloomington. This discussion focused on our company's value proposition for both the DoD and commercial technologies and how we are leveraging public-private partnerships in several states and on multiple programs. We discussed how our success with the RH90 program is a prime example of our differentiated approach for strengthening the domestic semiconductor manufacturing ecosystem. Also last month, we announced that the DoD is funding $12 million from the Phase 1 award announced last quarter for further IP ecosystem development, highlighting the importance of our partnerships with Trusted Semiconductor Solutions and Case. Both are critical collaborators for the evolution of RH90 platform with Trusted Semi driving the development of the PDK and associated IP libraries and Case providing their qualification expertise for DoD systems, both of which we expect to accelerate productization for RH90 platform, ensuring it meets the rigorous demands of mission-critical extreme environment applications. As I detailed last quarter, we also have multiple programs to complement RH90, allowing us to provide solutions into less stringent defense and commercial applications. These include the growing pipeline for ROICs, our readout ICs for infrared imaging and our planned expansion into low earth orbit satellite solutions. All these announcements and developments demonstrate the importance that public-private partnerships play towards furthering our unique semiconductor manufacturing model, both commercially and for the U.S. government, which brings me to an update on our strategies related to the CHIPS Act, including our partnership with Purdue University and the State of Indiana. I'll start with the recent appointment of Brian Lenihan as our Vice President of Government Relations. Brian is based in Washington, D.C. and brings extensive public policy experience, having served in a variety of public and private roles within the government affairs realm. Brian is charged with further deepening Sky SkyWater's relationships within all levels of government. Last quarter, we reported on our historic partnership with Purdue and the State of Indiana to build a new 300-millimeter semiconductor fab on Purdue's campus. In September, I attended Purdue's Annual Career Day with multiple federal and state government officials to discuss the role of universities like Purdue in creating the workforce of the future, which is a crucial component of CHIPS Act funding. My visit included a live and virtual keynote to over 600 engineering students to discuss SkyWater's unique position in the semiconductor industry and our future plans in West Lafayette. Last month, we returned to Purdue to host an executive roundtable with customers and suppliers, discussing how we intend to leverage our unique technology as a service business model to create long-term strategic partnerships in Indiana that will enable synergistic innovation, fast track secure manufacturing, strengthen domestic supply chains and foster national security. With the Purdue fab serving as a cornerstone of our country strategy to enable the resurgence of semiconductor manufacturing in the United States, we believe that we are uniquely positioned to leverage all four pillars of CHIPS funding as we continue to build momentum not only in Indiana, but also in Minnesota and Florida. This August, at our Bloomington headquarters, Senator Amy Klobuchar held a press conference highlighting the importance of key technology providers in Minnesota. Senator Klobuchar has long led efforts to boost American economic competitiveness and self-sufficiency and our visit to Bloomington was yet another proof point that we are a critical player in our nation's semiconductor resurgence and well positioned to be a prime recipient of future CHIPS Act funding. Which brings me to our strategy for continued growth and our heterogeneous integration operations in Florida and the exciting developments announced since our last earnings call. First, in August, we hosted Senator Marco Rubio at our SkyWater Florida facility to discuss the importance of IP protection and secure semiconductor manufacturing in the United States. Then in September, we announced a $36 million grant from the Department of Commerce to expand our heterogeneous integration facility in Kissimmee in partnership with Osceola County and BRIDG. This was an incredible accomplishment for our Florida team and partners and provides the vast majority of funding required to expand the capabilities and capacity at our Florida fab. As the only semiconductor company recipient of the EDA's Build Back Better Regional Challenge, this award was another example of our unique ability to leverage public-private partnerships to expand domestic semiconductor production. While not directly related to the CHIPS Act, being the only semiconductor recipient of the Build Back Better Challenge is yet another illustration that we're uniquely positioned to receive additional government awards. Based on our demonstrated success and prominent profile building between Senator Klobuchar's visit to Bloomington, continued momentum building in Purdue, Senator Rubio's visit in Kissimmee and our strong relationship with the Departments of Commerce and Defense, we believe we are in excellent position to be an essential player in the rebirth of the semiconductor industry in our country. As a reminder, there are three elements of our technology road map underway in Florida, IBAS, Deca and our work with Adeia. For IBAS, we completed Phase 1 of the government-funded interposer technology development program, establishing a proven capability to support BRIDG interposer fabrication to strengthen national security for critical emerging technologies. This program has now moved into the Phase 2 and Phase 3 stages of platform development with completion expected in early 2023. We are continuing our preparations to offer Deca's M-Series fan-out wafer level packaging technology, working with external equipment and service suppliers to support the fabrication of our initial demonstration vehicles. Working with Deca, we have also completed installation of our adaptive patterning engine, which is a key enabling capability for the Deca process technology. As part of our Build Back Better award, we expect to be placing orders for our first key pieces of equipment within the next few months to support the M-Series capability in Florida. We continue our technology transfer efforts with Adeia for