Thank you, Richard. Good afternoon, everyone, and thank you for joining us today. I'm pleased to report that Cadence delivered an outstanding Q4, wrapping up a record 2023, achieving 15% revenue growth, 42% non-GAAP operating margin, and over 20% non-GAAP EPS growth for the year. We exited 2023 with a record backlog of $6 billion, as customers increasingly committed to our chip-to-system integrated design and analysis platforms. We expect our innovative solutions to continue driving broad-based business momentum in 2024. John will provide more details in a moment. Secular trends of digital transformation, hyperscale computing and autonomous driving, all bolstered by an AI super-cycle, continue to fuel strong broad-based design activity. We continue successfully executing to our Intelligent System Design strategy, that triples our TAM opportunity while greatly expanding our portfolio. Our innovative engine delivered several significant products including most recently, the revolutionary Millennium M1 platform, the industry's first accelerated multi-physics supercomputing platform. The platform tightly integrates our Fidelity CFD software with high-performance GPUs and combines AI, HPC and digital twin technology to deliver an unprecedented 20x energy efficiency and up to 100x design impact. We were honored to have customers including Honda, Boeing and GE as speakers at our launch event. We substantially grew our footprint at market shaping customers and furthered our relationships with key ecosystem partners. We furthered our partnership with Intel Foundry through a strategic multi-year agreement on providing design software and leading IP at multiple Intel advanced nodes, thereby advancing Intel's IDM 2.0 strategy and accelerating mutual customer success. Cadence is at the forefront of the AI revolution, closely partnering with marquee companies on their trailblazing AI designs for training and inference from cloud to the edge. NVIDIA and Cadence have collaborated closely over several years, and in Q4, we deepened our partnership through a meaningful expansion of our hardware solutions and EDA software. Earlier in the quarter we announced our work on Cadence.ai with NVIDIA's Nemo Retriever, and now we're thrilled to deepen our partnership and extend it to the new Millennium MultiPhysics Supercomputer and SaaS solution which is co-optimized with NVIDIA's Accelerated Computing and AI platform. And as the exclusive EDA partner of Arm Total Design, Cadence and Arm are closely collaborating to accelerate the development of custom SoCs based on the Neoverse Compute Subsystem. Over the year, we've continued building out our generative Cadence.ai portfolio, the industry's broadest AI offerings spanning chip to board to system, and delivering exceptional optimization and productivity benefits. Earlier in Q2, we introduced Virtuoso Studio and Allegro X AI, bringing AI to custom/analog and PCB designs. And in Q4, we added Voltus InsightAI for automatically addressing voltage drop violations. We also pioneered bringing LLM capabilities to chip design, successfully helping Renesas accelerate functional specification to final design. Accelerating momentum of our Cadence.ai portfolio has led to an almost tenfold increase in the number of customers adopting our GenAI solutions in 2023, as customers embrace the technology to develop optimized products much more efficiently. Now, let's talk about some of the product highlights for Q4 and 2023. Rising system complexity and challenges stemming from the growing hyperconvergence of the electrical, mechanical and physical worlds, are driving the need for a seamless platform solution across design, packaging, simulation, and analysis. We made this a core tenet of our Intelligent System Design growth strategy six years ago, and our System Design and Analysis business continued its strong momentum, delivering 18% year-over-year growth in Q4 and 22% growth for the year. PCB and advanced packaging are linchpin technologies that sit at the crucial intersection of mechanical and electrical domains and Cadence's rich heritage in these areas remain a key strategic differentiator, especially in the emerging chiplet era. We continue advancing these technologies with Allegro X AI providing greater than 10x acceleration in PCB design, and endorsed by Schenider Electric and Kioxia at its launch. Our multi-physics analysis portfolio couples our expertise in physics-based modeling with AI-driven optimization and is delivering superior results to customers across multiple vertical segments, especially aerospace and defense, and automotive. Recently, we launched Celsius Studio, the industry's first complete AI thermal design and analysis solution for electronic systems, delivering up to a 10x performance benefit over legacy systems, with endorsements by Samsung and BAE Systems. And Wistron, a leading technical services provider used Optimality's AI-driven optimization technology and Clarity for fast, accurate electromigration in-design analysis, improving design reliability while realizing a 2x improvement in turnaround time. Our digital IC business finished another strong year with 22% revenue growth in Q4, as our solutions continued gaining share at market shaping customers, especially at the most advanced nodes. Our digital software is proliferating in all top 20 semiconductor companies and our digital full flow was adopted by 34 additional customers during the year. We are very pleased with the accelerating momentum of our flagship Cadence Cerebrus GenAI solution, whose transformative PPA and productivity benefits have led to its deployment in all our top 10 digital customers and used in well over 300 tapeouts. In Q4, Cadence Cerebrus run rate more than quadrupled at several market shaping customers and it also drove significant digital full flow expansions at two top tier semi customers Our Integrity 3D-IC platform is the industry's only unified 3D-IC design and analysis platform and ties our best-in-class SoC and package design technologies with system-level planning and analysis. In Q4, GUC successfully used Integrity to tapeout a complex 3D stacked die design with a wafer-on-wafer structure on an advanced FinFET node. Next, I will talk about our Functional Verification business, which had another remarkable year, delivering 11% year-over-year revenue growth in Q4 and 22% growth for the full year. Escalating system and software bring-up challenges, along with the pressing need for first-pass silicon success, continued driving strong demand for our Functional Verification solutions. Our best-in-class dynamic duo of Palladium