Thanks Mike. This past year has been an incredibly productive one with Atomera advancing across all customer categories, building our stature as a technology pioneer, entering new segments, and getting closer to first production. Building on the strength of Q3, our fourth quarter has been filled with progress on every front with one setback, and I'll start off with the details there. Last quarter, we mentioned an active negotiation with a transformative customer. Discussions underway -- have been underway with them for some time with periods of very intense negotiation followed by lengthy delays on their part. At the time of our last call, we felt very close to concluding a deal, but it has dragged on much longer than expected. And at this point, we have to say it has stalled. We are confident that MST can deliver to this customer one and a half to two generations of performance improvement in a critical area, and we are asking for only a small fraction of the economic value they would be receiving, but they still have yet to move forward. Although disappointing, it is not surprising, since resistance to innovative ideas is expected, and in this case, we're providing two; an externally developed material delivered with low upfront cost and an ongoing royalty, a format which is new to some customers. We continue to believe there is strong support for our technology at the engineering level in this company. Indeed, in this market segment, all of their competitors are struggling with the same issues, and we believe one or more of them will adopt MST for this application. Furthermore, we believe their ability to achieve the improvements they need through other means will be limited and will take much longer than would be possible by adopting MST. So, we are hopeful discussions will restart soon and we're doing everything we can to make that happen. The performance improvement potential we showed them is important to advance Moore's law across all semiconductors and in particular for artificial intelligence devices being designed today on the most advanced nodes using gate-all-around transistors. So, I'd like to dig a little deeper into the opportunity this market represents valued at about $150 billion in 2023. As leading advanced logic IDMs and foundries like TSMC, Samsung, and Intel ramp up manufacturing capability for the gate-all-around architecture at 2 nanometers and below, it is becoming increasingly clear, more so than in previous generations, that materials engineering will play a crucial role in driving the performance improvements expected at these nodes. The high costs associated with lithographic scaling have led fab module engineers to place greater emphasis on incorporating new materials into their standard toolbox for transistor engineering. Epitaxy is a critical process in this context, directly impacting the channel definition and source drain regions of gate-all-around transistors. Indeed, we believe that epitaxy is now more widely used than lithography in gate-all-around architectures. Since MST is an Epi-based technology, the barrier to incorporate MST into the process flow is much lower than it has been in the past. Given that gate-all-around requires at least twice as many Epi steps as the previous FinnFEST architecture, we anticipate that our partnerships with IDMs, foundries, and OEMs will significantly increase the potential for MST to be integrated into multiple regions of the gate-all-around transistor. These diagrams show different areas where MST can help improve performance of gate-all-around devices. In the channel area, MST can increase drive current and reliability by improving interface traps at the channel gate interface. MST can reduce contact resistance, improve transistor variability, reduce leakage in the source drain area, and even improve backside contacts. These are all problems the industry faces, and MST provides a compelling, fast time-to-market material solution. The memory segment, valued at over $125 billion in 2024, has many characteristics in common with the advanced node segment, except because it's a commodity market, it is hyper focused on low production costs. Similar to gate-all-around, memories are in a relentless drive to smaller node sizes. Today, Epi is being introduced into memory flows, enabling MSD to become a small incremental cost adder, while delivering substantial performance, die size, and margin improvement potential for our customers, even after paying us a royalty. As in gate-all-around, the opportunity is huge with very high volumes and long technology cycles. We have engagements with multiple customers in both these segments. Likewise, in RF-SOI, we provide a performance advantage that we do not believe is possible without MST. Not only can we assist with complex RF power switch devices, we can also improve LNAs and analog components critical for 5G mobile phones. Today, we are working with the majority of device manufacturers who use RF-SOI substrates in their designs. We continue to make inroads in the power semiconductor market, which is a large, rapidly growing segment driven by the power demands of AI, large compute infrastructure, and vehicle electrification. Our products here are MST SP for 5-volt and SPX for 5 to 48-volt devices. With ST as our lead customers, we are attracting interest from many other players in this segment. We expect this market to be worth over $52 billion in 2024, so innovations to drive efficiency, power, and cost savings are clearly needed. Gallium nitride also is emerging as a major market opportunity for us, projected to represent a $12 billion market in five years and growing at more than 26% annually. The great news here is that many of the potential customers for GaN overlap with our existing customer base and we have lots of interest from them and from others. Electrical results from our latest set of tests at Sandia are around the corner and we're hopeful they will provide enough ammunition to begin engagements with a lot of interested parties in GaN. Now, let me give a brief customer update. ST continues to progress very well in both design and manufacturability efforts. The next step, which is called process qualification, is complicated and the schedule can vary depending on how many issues they need to resolve. Typically, the industry takes about nine months on this step after which production will start. We are planning to announce when we enter process qualification, which will also result in us recognizing license revenue. So, you should be able to estimate production start timeframes from there. We are not free to update ST schedule otherwise. Efforts continue on JDA1, where data acquisition to address specifications they have given us is underway, including in areas beyond this initial scope of the JDA. JDA2 is starting a multistage wafer run with us demonstrating their commitment to getting beyond the development phase and into a license agreement enabling volume production in the future. Results from the latest wafer run with our fabless licensee have been received, but additional wafers need to be processed to achieve a full cycle of learning as the data we could extract from the prior run was incomplete. However, the results we were able to analyze provided insights which we believe will yield an even higher performance result in the next wafer lot, which we are working on right now. In the last three months, we've made headway with several other customers and in particular, two new ones who I would put into the category of transformative. We have been trying to start work with one of them for years without success until now and they've recently started their first demo wafer run with us, a major milestone. The other has solidified plans for a comprehensive set of wafer runs to validate their own internal TCAD simulations, which show very promising results using MST. We've been pursuing each of these opportunities for quite a while, and they have now moved to an implementation stage. I call these customers transformative because they are some of the industry's largest manufacturers. They have the ability to move quickly and they are well known for cutting edge products. Our business potential with each of them is huge. Finally, our ability to land-and-expand has really accelerated this past quarter with two of our existing customers planning demos in entirely different product areas than our original engagements. We believe this illustrates a few positives. First, it shows that customers who have worked with MST believe in the technology enough to recommend its use by other product lines. Second, it shows how deeply our customer relationships go once we start working together on a serious engagement. We've talked about the domino effect in the past and this is a sign that it's starting to happen with existing customers and will hopefully lead to wider adoption over time. 2024 has been a very good year of market and technology development at Atomera. We solidified our value proposition in four major high growth markets in semiconductors and positioned ourselves to enter into another that offers a path to faster time-to-revenue, while still supporting the enormous potential of our traditional business model. Our R&D pipeline in new markets and applications continues to expand as reflected in our patent portfolio, which had an increase of over 30 granted and pending patents in 2024. Our new business development execution is clearly improving as evidenced by our deeper penetration with both new and existing customers and with partners. Right now, our team morale is high because we are getting direct feedback from customers that our technology provides important solutions necessary to deal with big issues in the semiconductor roadmap. Our engineers are doing the detailed, innovative, and thorough work that they know is necessary to overcome customers' bias for internally developed solutions and to integrate our technology into their designs. ST is a great example of how this can happen in a large successful company, and right now they are moving nicely towards production. Our potential in other target markets is even larger, and I feel we are close to announcing deals which will cement that position. The work we are doing in gate-all-around and memory is tied directly to the biggest driver of the semiconductor industry today, the rollout of AI infrastructure. Our gate-all-around work is not only aligned with a major industry push, but we also believe it can be executed with faster time to revenue than our other segments. There is no doubt about the value proposition we are offering the industry, and we believe it will ultimately allow us to build Atomera into a successful material solution provider to the entire industry. Now, Frank will review our financials.