Thank you, Jennifer. Good afternoon, everyone, and thank you for joining the call today. Amkor delivered second quarter performance in line with expectations with revenue of $1.46 billion and EPS of $0.27. Total revenue increased 7% sequentially, driven by demand for advanced packaging, notably for premium tier smartphones and 2.5D technology for AI solutions. During the quarter, we maintained focused on our strategic pillars to elevate our leadership position. We successfully brought online additional capacity for 2.5D technology in Korea and qualified advanced SiP and memory technology in Vietnam to support production ramps in the third quarter. Additionally, we are excited that we have reached a significant milestone in establishing a US manufacturing presence for advanced packaging. We aligned on a nonbinding preliminary memorandum of terms with the US Department of Commerce for up to $400 million in grants under the CHIPS and Science Act. These funds will support building a new facility in Arizona, enabling advanced packaging and test for high-performance computing, AI, communications and automotive markets. We look forward to being part of a strong ecosystem of front-end fabs, IDMs and suppliers in establishing a resilient US semiconductor supply chain. Now let me review the current dynamics in each of our end markets. Revenue in the communications end market increased 10% sequentially. Within the iOS ecosystem, we experienced a larger than seasonal increase driven by bills for the full launch of premium tier smartphones. Revenue within the Android supply chain declined slightly sequentially, but still showed a strong 20% year-on-year growth. Our advanced packaging technology supports a wide range of applications and functionality throughout the phone. With our advanced SiP technologies for heterogeneous integration together with our proprietary flip chip package on package technology, we support the full range of applications from RF and camera to the latest AI-enabled apps processors that require high-speed and high-density interconnect with fine pitch bonding. Revenue from our automotive and industrial end market was down 2% sequentially. The coverage in this market is taking longer than anticipated due to weak demand and ongoing inventory corrections. Despite these near-term dynamics, we believe the long-term drivers for growth remain intact. Semiconductor content per car is expected to continue to increase, driven by the proliferation of ADAS, electrification, infotainment and telematics all requiring advanced packaging technology. Amkor is the leading automotive OSAT and has multiple decades of experience meeting the stringent requirements of the automotive industry. With a broad portfolio of advanced and mainstream technologies and established large-scale manufacturing base in critical regions like Europe and Japan and trusted relationships with key customers in the automotive supply chain, Amkor is well positioned to support the secular growth in this market when it exits the current cycle. Revenue from the computing end market increased 20% sequentially, driven by strength in AI devices and several new product introductions for ARM-based PCs. We executed on our planned expansion for 2.5D capacity for AI devices more than tripling our capacity versus second quarter of 2023. In the third quarter, we expect constraints and high bandwidth memory supply to limit revenue growth. Amkor is leading the OSAT supply chain with the deployment of 2.5D technology. And with the robust demand and additional capacities, we now expect the full year 2.5D revenue to quadruple versus 2023 levels. We continue to partner with multiple customers on next-generation technology, utilizing organic interposers and expect those solutions to be brought to market in the first half of 2025. Revenue from the consumer end market decreased 6% sequentially, driven by the wind down of legacy IoT devices ahead of the expected ramp-up of next-generation products. Traditional consumer product demand has been muted, but the high-volume production ramp of a new wearable product utilizing advanced SiP technology is expected to start in the third quarter. Consumer IoT devices require many authorization with increasing levels of integration. Our advanced SiP technology for heterogeneous integration positions us well to meet these requirements and our new Vietnam facility enables us to continue to drive manufacturing scale and innovation. During the second quarter, our manufacturing organization had to manage multiple challenges. On one hand, several factories still showed low utilization where focus was on cost control while maintaining high-quality standards. On the other hand, we executed the capacity ramp for 2.5D technology in Korea, qualified advanced SiP and memory technology in Vietnam and prepared for the steep seasonal ramp in the third quarter. Additionally, the team further progressed with our advanced packaging and test facility in Arizona by advancing factory design and construction planning and working with customers to develop the technology road map and capacity loading scenarios. During the second half of the year, cost and quality, together with managing a steep seasonal ramp, will remain top priorities. Now let me turn to our third quarter outlook. Considering current market conditions, we expect third quarter revenue of $1.835 billion at the midpoint of guidance. This represents sequential growth of 26%, driven by advanced packaging in support of the seasonal launch of premium tier smartphones, the ramp of a new consumer wearable device and continued strong demand in high-performance computing and ARM-based PCs. The slower-than-expected recovery in the automotive and industrial markets, together with the continued weak demand in traditional data centers has dampened anticipated growth in the third quarter. Looking forward, we remain confident that the secular growth drivers for the industry remain in place. With our strong technology leadership in advanced packaging, a uniquely diversified global footprint and partnerships with lead customers, we are well positioned to accelerate while exiting this cycle. With that, I will now turn the call over to Megan to provide more detailed financial information.